Ir Fet



The IR MOSFET™ family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS, lighting, load switches as well as battery powered applications. The devices are available in a variety of surface mount and through-hole packages with industry standard footprints for ease of design. The optimized gate drive options enables designers the flexibility of selecting super, logic or normal level drives.

  1. Ir.fetrak.back_fire
  2. IRHLNM87Y20 Electrical Characteristics
  3. International Rectifier - Single Rad-Hard MOSFETs
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Infineon is the market leader in highly efficient solutions for power generation, power supply and power consumption. The latest generation of Infineon’s MOSFET transistors were designed to ensure market leading performance, improve efficiency and to achieve better thermals in terms of the state of the art EMI behavior.

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Fet

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International Rectifier has been meeting this challenge for over 20 years and now offers a comprehensive portfolio of high-reliability, ruggedized discretes and integrated ICs including solutions for DC-DC conversion, solid state switching and motor control. Explore Our Ground-breaking Technologies. To avoid bankruptcy, International Rectifier gave Pfizer its animal health and feed additive businesses. 2000: developed FlipFET wafer packaging; 2002: developed DirectFET, a MOSFET packaging technology developed to address thermal limitations found in advanced computing, consumer and communications applications.

IRHLNM87Y20 Electrical Characteristics

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International Rectifier - Single Rad-Hard MOSFETs

AC-DC applications requiring high-voltage blocking capability and fast switching with low losses take advantage of the revolutionary CoolMOS™ superjunction technology for more efficient power supplies. Infineon’s superjunction MOSFETs serve today's and especially tomorrow’s trends in different topologies, ranging from a simple flyback to TCM Totem Pole PFC. Designers benefit from a lower temperature, the improved form factor, and increased efficiency.